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What is the use of the 41 million pixels that cannot be optically zoomed in? Someone who has a certain amount of research on the camera knows that this exceeds the pixel index of most high-end digital cameras. Actually, it is still the level of the cell phone camera in actual performance, but only through high pixels. More to make up for the loss of image quality that cannot be caused by optical zoom. On the other hand, 41 million pixels is also a challenge for storage and output. Few people will use such large photographs, and most of the people who have used them already have professional cameras that feel even closer than the other half.
Therefore, Nokia's PureView 808 is just a mobile phone capable of displaying great mobile-level digital photos. It is expected to replace the existing SLR. It is a bit ridiculous for the somewhat sought-after "friends." However, for those who wish to leave a â€œget here and thereâ€ figure, it is undoubtedly an extremely tempting figure.
The true meaning of 41 million pixels is to enable users to capture larger original materials by means of high-pixel sensing, and use corresponding software to obtain better-compressed photographs instead of optical zoom.
Looking at some related introductions, this time the Nokia PureView 808 uses a 1/1.2-inch image sensor, which is a significant improvement over the general high-end portable camera's 1/1.7. That is, the Nokia PureView 808 is the first truly from the core hardware. On the phone completely beyond the high-end portable digital camera. At this point, we should give Nokia PureView 808 little support. However, there is still a slight gap between the high-end SLRs and the 1 inch. This means that even if the number of pixels is more than double the number of high-end SLRs, there is still a gap in the actual viewing range.
Hype speculation, 41 million pixels This girl is not a castle in the air, Nokia naturally needs advanced technology to cooperate. For a high-resolution mobile phone lens, the quality of the pixel depends on the quality of the photo. Of course, the more the theory is, the better. However, it actually includes other optical technologies, such as image processing, and it also seriously affects the quality of the photo. Therefore, there are many related problems in the middle, such as how high the pixel is, how the lens is designed. More often than not, modules are getting smaller and smaller. The smaller it is, the more the design of the camera is. What do you do with other things outside the lens? How do these softwares work together? These are many tips.
Before the detailed report, I can only rely on my previous understanding, to introduce some advanced camera module technology, perhaps it is used in Nokia PureView 808.
If such a large sensor is integrated into a mobile phone, its size and area must be kept to a minimum. At the same time, its reliability and photographic characteristics must be guaranteed. The requirements for the packaging technology are very high. The author thinks of the Tessera company that came into contact two years ago. Package camera module technology. Chip size packaging technology (CSP) is the company's widely used technology in many semiconductor fields, and they are also used in the packaging of digital camera modules.
If we look at Tessera's vision for the development of the camera, we have two ways to look at it. The first way is that the camera can be used to capture some moments to optimize it, and these moments will be displayed again. Some examples in this regard include some current digital cameras, or mobile phones with camera heads, and laptops with video conferencing capabilities, as well as TVs in the future, because perhaps TVs can also make video calls in the future. On the other hand, the camera module will develop rapidly both in terms of size and people's interest in it. Now the camera module can be used to capture various images, and it can also be used for intelligent analysis of images. After these intelligent analysis, we can take some corresponding actions, which we call intelligent module management. Under the conditions mentioned above, this image will not be displayed. Take some examples to see, for example, in the future reading of barcodes or recognition of human faces to do some games, or recognition of some sittings, some toys and cars and advertisements, how people see the way of advertising, and safety and medical The domain will use the smart module management we just mentioned. Tessera believes that in the next few years, this market segment will have a size of more than 3 billion. To help such a market to develop rapidly and continue to innovate, in December 2005, Tessera will Purchased six companies to expand their business scope. We spent a total of $215 million to create a one-stop shop for our users.
In such a one-stop service center, our users can get the image and optical solutions they need. Our goal is to bring some new applications to existing digital cameras. Our hardware foundation is based on wafer-level technology. The first is our wafer-level packaging technology. There are two packaging methods when people generally package camera modules. In the traditional way, people adopt chip-on-board packaging. In such a packaging technology, the sensor of this image is connected to its backplane through a wire bonding method and put on top of each other. The lens module. One problem with such a chip-on-board packaging technique is that as the camera's sensor pixels continue to increase, the size of the pixel is constantly decreasing, which may cause damage to the image sensor. In other words, a slight change in the size of each ion may cause the image sensor to be destroyed.
The new technology of chip-size packaging is actually equivalent to adding a glass cover to the image sensor so that each die can be well protected. Another benefit of this technology is surface mountability, and now more than 50% of CMOS sensors shipped worldwide use our CSP technology. Of these image sensors that use 50% of CSP technology, 90% are Tessera's technology.
In software, Tessera's technology includes OptiML series of image enhancement technology, wafer-level technology, and professional optics for small camera equipment.
â€¢ OptiML image enhancement technology is available for software, chip, and optical solutions, and provides camera functions such as high-quality autofocus, face detection, and red-eye reduction to a range of mobile devices.
â€¢ OptiML wafer-level packaging enables smaller, thinner, higher performance, more reliable, and less expensive image sensors.
â€¢ OptiML micro-optics solutions include diffractive and refractive optics and integrated micro-optics subsystems for semiconductor, optoelectronic, communications, consumer, and medical applications.
Of course, Nokia did not use optical zoom in PureView 808. In fact, using Tessera's packaging technology combined with MENS technology, it is possible to achieve optical zoom in the module of the phone lens. According to reports, a camera with a thickness of about 10mm is currently available. The module can easily achieve 3-5 times optical zoom (at the end of 2010) without affecting any module design. Only with optical zoom, maybe the mobile phone really launches the most powerful challenge like a digital camera.
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